As the core soldering material, the quality of BGA solder balls significantly influences the soldering quality and reliability. BGA solder balls play three critical roles on the chip’s pins:
- Mechanical Connection (Soldering): BGA solder balls provide the mechanical connection between the chip and the PCB, ensuring that the chip stays securely attached during use.
- Electrical Signal Transmission: The solder balls facilitate the electrical connection, allowing signals to be transmitted between the chip and the PCB, ensuring proper functioning of the device.
- Heat Dissipation Assistance: BGA solder balls also aid in heat dissipation by providing a thermal pathway, helping to manage the chip’s temperature and enhance its overall performance.
By fulfilling these essential functions, BGA solder balls contribute to the chip’s stability, signal integrity, and thermal management, playing a pivotal role in high-performance and reliable electronic devices.
