As the core soldering material, the quality of BGA solder balls significantly influences the soldering quality and reliability. BGA solder balls play three critical roles on the chip’s pins: Mechanical Connection (Soldering): BGA so...
Physical Protection and Reliability Enhancement Protection from Mechanical Damage: The packaging shell protects the chip from external impacts, vibrations, and bending. Environmental Protection: It shields the chip from moisture, d...
A wafer is a thin, round silicon slice (similar to the "pizza crust") and serves as the "raw material substrate" for chip manufacturing. It is made from high-purity single-crystal silicon.A chip (or die) is an individual circuit unit pr...
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